Tag: Packaging

ACCEDE – ESCCON 2027

Shaping the Future of EEE Components Usage for Space Applications. 9th – 11th March 2027 | Seville | Spain ACCEDE – ESCCON is the European reference congress on EEE components…
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ESA Industry Space Days 2026

The ISD is organised by the SME section in the ESA Directorate of Controlling, Finance and Operational Procurement to foster cooperation between different actors in the entire space sector. Key…
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6th SPACE PASSIVE COMPONENT DAYS – SPCD 2026

6th SPACE PASSIVE COMPONENT DAYS – SPCD 2026 13-16 October 2026 | ESA/ESTEC Noordwijk, The Netherlands Overview Passive Components represent more than 80% of the EEE parts used in spacecraft. Therefore, they…
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ALTER – Supporting CELESTE LEO‑PNT Mission

Alter Technology is proud to play a key role in the qualification and validation of the CELESTE IOV satellite, the first in-orbit demonstrator of the ESA LEO-PNT programme led by…
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EASii IC satellite modem ASIC, EZID211 also known as Oxford-2

EASii IC announces the full mass production milestone for its satellite modem ASIC, EZID211 also known as Oxford-2. EASii IC is a fabless company that develops digital, analog, mixed and…
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EASii IC : Integrated Circuits ASIC or SOC Design House

EASii IC is a fabless company that develops digital, analog, mixed and RF integrated circuits. EASii IC also designs PCBs and FPGAs. Web site: https://easii-ic.com/   EASii IC operate in…
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ALTER – Long-Term Storage of EEE parts Services

Alter Technology perform proper storage of EEE parts surplus according to MIL and ESA procedures relevant to managing the storage process and their associated tasks. For reference, see : ESCC 24900:…
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ALTER – Scanning Acoustic Microscopy (C-SAM)

Scanning Acoustic Microscopy (C-SAM) Electron Microscopy for Ensuring the Integrity of Critical Devices In high-reliability industries such as aerospace, automotive, and aviation, ensuring the structural integrity of electronic components is…
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