Tag: Packaging

ALTER – Scanning Acoustic Microscopy (C-SAM)

12/04/2026

Scanning Acoustic Microscopy (C-SAM) Electron Microscopy for Ensuring the Integrity of Critical Devices In high-reliability industries such as aerospace, automotive, and aviation, ensuring the structural integrity of electronic components is essential for safe and reliable operation. Interfacial defects such as delamination may significantly compromise device performance and long-term reliability if not properly detected and characterised.…
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MIL-PRF-ATM (Advanced Technology Microcircuit) for SiP and MCM devices

09/04/2026

Introduction MIL-PRF-ATM (Advanced Technology Microcircuit) is intended to provide an avenue to introduce advanced packaged ICs with through silicon via (TSV) and other integration technologies into the Military and Space QML system MIL-PRF-ATM works alongside MIL-PRF-38535 (Integrated Circuits) and MIL-PRF-38534 (Hybrids) to ensure there is a path for EEE components using these integration methods to…
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ALTER Semiconductor Packaging and Assembly

08/04/2026

Packaging and Assembly for optoelectronics and microelectronic devices ALTER provides outsourced assembly/packaging and testing of Microelectronic Semiconductor devices such as ICs, ASICs, MEMS, Sensors, laser Diodes and Discretes, offering a complete back-end service from Package design, Assembly and Packaging, Testing, Measurements and qualification. ALTER offer hermetic packaging of die into robust ceramic and metal packages…
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ALTER Virtual Lab for E.E.E. Components and Equipments

07/04/2026

Are you looking for an efficient and convenient way to monitor the tests performed on your samples? We are thrilled to introduce you to Virtual Lab – a cutting edge platform developed by ALTER TECHNOLOGY and used by hundreds of companies around the world that enables you to track the progress of your tests in…
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ALTER Laboratory Services for E.E.E. Components and Equipments

10/03/2026

ALTER specialized laboratory services for testing and qualification of EEE (Electrical, Electronic and Electromechanical) components and Equipment for High Reliability applications. ALTER capabilities include: Radiation Test Environmental Testing Electrical Testing Component Qualification Materials & Processing Mechanical Testing RF & Microwave Testing In addition , ALTER’s services extend to full equipment testing and certification, supporting sectors…
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ALTER enters US market with state-of-the-art semiconductor testing facility in Minnesota

26/02/2026

ALTER enters US market with state-of-the-art semiconductor testing facility in Minnesota   New Testing Capabilities in Minnesota The new cutting-edge 14,000 sq ft semiconductor testing facility includes a 4,000 sq ft class 10,000 clean room and is equipped with state-of-the-art testing equipment that meets the highest industry standards. ALTER US aims to position itself as…
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ESA – General Support Technology Programme (GSTP)

01/07/2025

The GSTP (General Support Technology Programme) enables missions by making sure the right Technology, at the right maturity level is available at the right time. What is GSTP? Through the optional General Support Technology Programme (GSTP) ESA, Participating States and Industry work together to convert promising engineering concepts into a broad spectrum of useable products. The…
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ALTER – PCB Materials and processes laboratory

15/05/2025

ALTER TECHNOLOGY – PCB Materials and processes laboratory The mission of this area is to thoroughly assess the reliability of materials and processes involved in the manufacturing of components for space. It involves these interrelated activities: ▪Soldering verification ▪Component defect evaluation ▪Raw material evaluation ▪PCB coating evaluation ▪Blistering and delamination analysis ▪Tin whisker testing ▪Moisture…
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