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Tag: Packaging

UMS GH25-10 GaN technology Space evaluated

 UMS is proud to announce that the GH25-10 MMIC GaN HEMT technology is successfully space evaluated and now part of the European Preferred Part list (EPPL) established by the European Space Agency ESA https://escies.org/download/ The reliability study and ESCC evaluation of the technology have been supported by ESA, French MoD and CNES. This GaN 0.25µm…
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UMS has launched 2 new VCOs operating in S and C band

The CHV1203-98F and CHV1206-98F are 2 fully integrated VCOs including negative resistor, varactors and buffer amplifiers. They exhibit high frequency stability and have been designed with space de-rating. Although designed for space, they are suitable for a wide range of applications including commercial communication systems. These circuits are manufactured using a 2µm InGaP HBT process.…
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ICs Packaging

The integrated circuit chip is too small and delicate to be handled directly. Each chip is bonded to a set of tiny gold or aluminum wires and set into a flat block of plastic or ceramic. The block has metal pins on the outside, leading to the wires inside. The pins form a solid mechanical…
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