ALTER Semiconductor Packaging and Assembly
Packaging and Assembly for optoelectronics and microelectronic devices ALTER provides outsourced assembly/packaging and testing of Microelectronic Semiconductor devices such as ICs, ASICs, MEMS, Sensors, laser Diodes and Discretes, offering a complete back-end service from Package design, Assembly and Packaging, Testing, Measurements and qualification. ALTER offer hermetic packaging of die into robust ceramic and metal packages…
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