Tag: Components

  1. Home
  2. >
  3. Components

COTS Components in Space Systems: Benefits and Risks

Space is becoming a more and more competitive, asking continuously for higher performance figures while reducing the overall Cost from missions. Such a trend has consequences at all levels down to the selection and procurement of building blocks and Electronic components. The usage of COTS (Commercial Off The Shelf) or PEM / PED (Plastic Encapsulated…
Read more

UMS new products CHA2595-98F / CHA3395-98F / CHR2270-QRG

United Monolithic Semiconductors (UMS) European leader in RF MMIC – Monolithic Microwave Integrated Circuit (GaAs, GaN, SiGe technologies) Products and Foundry services for Defence, Space, Telecom, Automotive, and Radar is pleased to inform about 3 New products: CHA2595-98F 27.5-43.5GHz Low Noise Amplifier Ref: CHA2595-98F-FULL-1168 Product information: Performance to highlight: Wideband LNA: 27.5-43.5GHz Designed for a…
Read more

AirBorn – FLEX Assemblies for Space Applications

Advantages of Flex Cable Assemblies in Space: • reduced size and weight (up to 60% less weight and space) • ability to fold and form • reduced integration time • reducing failure rates during wiring • repeatability • Higher density designs due to smaller pitch sizes or multiple layers (up to 34 layers) • no…
Read more

COTS components in Space applications

Space is becoming a more and more competitive sector, asking for higher performance but reducing the overall Cost of the Missions. In parallel, Electronic, Electrical and Electromechanical (EEE) parts designed for terrestrial application such as Automotive sector show High Reliability levels in the targeted applications when produced in massive quantities and while being the subject…
Read more

ESCC 9000

Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows: • Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components • Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and…
Read more

ESCC 5010

Generic Specification for Discrete Microwave Semiconductor Components This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete microwave, semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES

ESCC 5000

Generic Specification for Discrete Semiconductor Components. This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES

ESCC EPPL – EUROPEAN PREFERRED PARTS LIST

The EPPL is divided into two parts: – Part I components have sufficient data to permit their use without any special provision, on condition that they meet the application requirements. – Part II components have minimum evaluation data demonstrating capability to satisfy Space-application requirements, but additional testing effort may be necessary to satisfy specific programme…
Read more

ESCC QML – Qualified Manufacturers List (REP 006)

This document contains a list of Qualified Manufacturers that have been certified by the European Space Agency for technology flows to the rules of the ESCC system with principle reference to ESCC Last version link on ESCIES

Chinese (Simplified)EnglishFrenchItalianRussian