If you are involved in EMS manufacturing Industry, you can end up with excess inventory for many reasons: Program schedule imposes Advanced procurements although production department BOM (Bill of Material) not yet frozen or wrong estimation of how many finished products could have been actually sell to market. Obsolescence and/or End of Life issues could…
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The COVID-19 pandemic has driven the Electronic Components shortage with severely Supply chain disrupted. The continue impact to global freight and logistics for longer Lead Times and Material Costs increased to supply chains remains a critical issue. Defense, Military and Aerospace sectors are faced with increases due to an upward trend in raw materials pricing…
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X-REL Semiconductor a division of EASii IC, designs innovative High-Reliability & High-Temperature Integrated Circuits and Systems. Products are made to reliably perform for years while ensuring the reduction of the overall system costs all along the product lifecycle. Easii IC is a fabless company working with worldwide recognized contractors which allows us to offer products…
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Counterfeiting in the Electrical and Electronic systems supply chain continues to be a major problem that affects all companies! Sales of counterfeit electronic parts have increased dramatically in recent years. This increase has resulted in steep industry costs, including the costs of mitigating counterfeiting risks, replacing failed parts, lost sales, and diminished brands and business…
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United Monolithic Semiconductors (UMS) European leader in RF MMIC – Monolithic Microwave Integrated Circuit (GaAs, GaN, SiGe technologies) Products and Foundry services for Defence, Space, Telecom, Automotive, and Radar is pleased to inform about 3 New products: CHA2595-98F 27.5-43.5GHz Low Noise Amplifier Ref: CHA2595-98F-FULL-1168 Product information: Performance to highlight: Wideband LNA: 27.5-43.5GHz Designed for a…
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Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows: • Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components • Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and…
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Generic Specification for Discrete Microwave Semiconductor Components This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete microwave, semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
Generic Specification for Discrete Semiconductor Components. This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
