ALTER – Scanning Acoustic Microscopy (C-SAM)
- Home
- /
- POSTS
- /
- Technology
- /
- ALTER – Scanning Acoustic...
Scanning Acoustic Microscopy (C-SAM) Electron Microscopy for Ensuring the Integrity of Critical Devices
In high-reliability industries such as aerospace, automotive, and aviation, ensuring the structural integrity of electronic components is essential for safe and reliable operation. Interfacial defects such as delamination may significantly compromise device performance and long-term reliability if not properly detected and characterised.
Non-destructive inspection techniques such as Scanning Acoustic Microscopy (C-SAM) are widely used for detecting internal defects. However, their effectiveness may be limited when inspecting devices with complex geometries or irregular internal structures.
This article highlights the importance of Scanning Electron Microscopy (SEM) as a strategic tool for confirming, characterising, and understanding microstructural defects that may remain undetected using acoustic inspection methods. A case study involving the inspection of electronic devices illustrates the complementary role of SEM in high-reliability quality control and failure investigation processes.
Scanning Electron Microscopy (SEM) plays a key role in providing detailed insights into the integrity of internal interfaces.
Non-Destructive Inspection Using C-SAM
Scanning Acoustic Microscopy (C-SAM) is widely used as a primary non-destructive inspection technique for detecting internal defects in semiconductor packages and electronic assemblies.
C-SAM operates by transmitting ultrasonic waves into the material and analysing the reflected signals from internal interfaces where acoustic impedance changes occur.
Despite its effectiveness, the technique presents certain limitations when inspecting structures with irregular or curved geometries. In such cases, the propagation of ultrasonic waves may be affected by scattering, which reduces the energy reflected toward the transducer.
As a result, defects located at certain interfaces may not produce sufficient acoustic contrast to be detected.
This limitation becomes particularly relevant when evaluating devices intended for mission-critical applications.
Conclusion
The case presented in this article demonstrates that although non-destructive inspection techniques such as C-SAM are highly effective for initial defect screening, their detection capability may be limited in structures featuring complex or curved geometries.
In the investigated device, the dispersion of ultrasonic waves caused by the curved paddle surface prevented the acoustic detection of an interfacial delamination. However, destructive cross-section analysis combined with SEM imaging successfully confirmed the presence of the defect and enabled detailed microstructural characterization.
SEM provides significant advantages in this context, including:
- High spatial resolution for detecting microstructural defects
- Detailed morphological characterization of critical interfaces
- Identification of failure mechanisms
- Support for root cause analysis and reliability investigations
To further evaluate the reliability impact of the detected defect, the components will undergo temperature cycling testing. Post-test inspection using C-SAM and SEM will allow assessment of defect evolution and determination of whether the observed delamination represents an isolated anomaly or a potential reliability concern.
In industries where operational reliability is essential and failure is not an option, the integration of non-destructive inspection techniques with destructive microstructural analysis and environmental stress testing provides a robust and comprehensive strategy for ensuring device integrity and long-term performance.
Read more on www.doeeet.com/content/eee-testing/material-processes-testing/
Contacts
ITALY Agent : DANILO LAUTA
|
ALTER Technology
|
CONTACT MODULE
