ALTER Semiconductor Packaging and Assembly
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Packaging and Assembly for optoelectronics and microelectronic devices
ALTER provides outsourced assembly/packaging and testing of Microelectronic Semiconductor devices such as ICs, ASICs, MEMS, Sensors, laser Diodes and Discretes, offering a complete back-end service from Package design, Assembly and Packaging, Testing, Measurements and qualification.
ALTER offer hermetic packaging of die into robust ceramic and metal packages for high-reliability and harsh environment applications such as space, aerospace and defence.
ALTER provide a range of assembly services for hermetic packaging includes:
- Wafer Saw
- Die bonding (eutectic and epoxy attach)
- Au Ball, Au/Al Wedge and Ribbon wire bonding
- Wire pull/Die Shear
- Fiber alignment and attach
- Internal visual inspection
- Hermetic sealing
- X-ray imaging
ALTER’s expertise and capability in encapsulation and hermetic sealing will reduce risk and reduce time to market as well as provide a cost-effective manufacturing option.
ALTER also offers full design and assembly of custom products, including package and lid design and procurement. Finite element analysis can be included to select the correct materials for the customer’s thermal requirements, and mechanical stress modelling can be used to evaluate the package and de-risk the design from failures at later stages of the qualification.
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ITALY Agent : DANILO LAUTA
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