UMS completion SMART3 of EC IPCEI Initiative for Advanced Packaging Solutions

This collaboration built on the success of the earlier 5G_GaN2 project and marked a continued commitment to pioneering advanced packaging methods and heterogeneous integration in the semiconductor field.

Through SMART3, UMS established strategic partnerships and collaborative projects with several leading public European research institutions and private enterprises. This effort was part of the framework “Plan Nanoélectronique 2022”. Supported through the financial contribution of the Région Nouvelle-Aquitaine and other major stakeholders, Smart3 was designed to foster a robust, collaborative ecosystem aimed at achieving greater technological independence in advanced packaging methods.

The projects undertaken as part of SMART3 spanned a wide range of objectives, from acquiring fundamental knowledge to co-developing innovative solutions tailored to meet future technology requirements. Notably, work focused on the heterogeneous integration of RF GaAs and GaN technologies, targeting the next generation of communication and sensor systems alongside silicon technologies.

In addition to technical achievements, the project facilitated significant non-technical outcomes, including career development opportunities, direct employment prospects, and enhanced participation and outreach within the respective technical communities.

Xavier Crosnier, CEO of UMS stated, “I was very pleased with the results of this program. We demonstrated with our development partners that wafer-level packaging could address the future needs of UMS and our clients, covering a wide application space from low frequency up to E-band, as well as on the crucial axis of RF power. This was one of the key innovations within this program.”

UMS remains committed to driving innovation and enhancing the European semiconductor landscape through collaboration and technological advancements.